{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466543","patent":{"patent_number":"US-8466543","title":"Three dimensional stacked package structure","assignee":null,"inventors":[],"filing_date":"2010-05-27T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"An apparatus, system, and method are disclosed for connecting integrated circuit devices. A plurality of primary electrically conductive contacts and a plurality of primary electrically conductive pillars are electrically coupled to a primary integrated circuit device. The plurality of primary electrically conductive contacts form a pattern corresponding to secondary electrically conductive contacts disposed on one or more secondary integrated circuit devices. The plurality of primary electrically conductive pillars extends away from the primary integrated circuit device. The plurality of primary electrically conductive pillars forms a pattern that corresponds to substrate electrically conductive contacts that are disposed on a substrate. The plurality of primary electrically conductive pillars and associated connecting material provide a standoff height between the primary integrated circuit device and the substrate that is greater than or equal to a height of the one or more secondary integrated circuit devices."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Three dimensional stacked package structure","description":"An apparatus, system, and method are disclosed for connecting integrated circuit devices. A plurality of primary electrically conductive contacts and a plurality of primary electrically conductive pil","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466543","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466543","citation_suggestion":"Patentable. \"Three dimensional stacked package structure\" (US-8466543). https://patentable.app/patents/US-8466543","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466543","json":"https://patentable.app/api/llm-context/US-8466543","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:13:58.933Z"}