{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466548","patent":{"patent_number":"US-8466548","title":"Semiconductor device including excess solder","assignee":null,"inventors":[],"filing_date":"2011-05-31T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first metal layer. The first metal layer includes a groove extending around sidewalls of the first semiconductor chip. The groove is at least partly filled with excess solder from the first solder layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including excess solder","description":"A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first m","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466548","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466548","citation_suggestion":"Patentable. \"Semiconductor device including excess solder\" (US-8466548). https://patentable.app/patents/US-8466548","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466548","json":"https://patentable.app/api/llm-context/US-8466548","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:02:47.779Z"}