{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466552","patent":{"patent_number":"US-8466552","title":"Semiconductor device and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2011-06-21T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A manufacturing method of a semiconductor device includes: forming a columnar electrode on a semiconductor wafer; flip-chip bonding a second semiconductor chip onto the semiconductor wafer; forming a molding portion on the semiconductor wafer, the molding portion covering and molding the columnar electrode and the second semiconductor chip; grinding or polishing the molding portion and the second semiconductor chip so that an upper face of the columnar electrode and an upper face of the semiconductor chip are exposed; and cutting the molding portion and the semiconductor wafer so that a first semiconductor chip, where the second semiconductor chip is flip-chip bonded and the columnar electrode is formed, is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of manufacturing the same","description":"A manufacturing method of a semiconductor device includes: forming a columnar electrode on a semiconductor wafer; flip-chip bonding a second semiconductor chip onto the semiconductor wafer; forming a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466552","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466552","citation_suggestion":"Patentable. \"Semiconductor device and method of manufacturing the same\" (US-8466552). https://patentable.app/patents/US-8466552","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466552","json":"https://patentable.app/api/llm-context/US-8466552","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:06:52.386Z"}