{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466553","patent":{"patent_number":"US-8466553","title":"Semiconductor device and semiconductor package having the same","assignee":null,"inventors":[],"filing_date":"2010-10-12T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present invention relates to a semiconductor device and a semiconductor package having the same. The semiconductor device includes a conductive element. The conductive element is disposed on a protruded conductive via and liner, and covers a sidewall of the liner. Whereby, the conductive element can protect the protruded conductive via and liner from being damaged. Further, the size of the conductive element is large, thus it is easy to perform a probe test process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and semiconductor package having the same","description":"The present invention relates to a semiconductor device and a semiconductor package having the same. The semiconductor device includes a conductive element. The conductive element is disposed on a pro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466553","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466553","citation_suggestion":"Patentable. \"Semiconductor device and semiconductor package having the same\" (US-8466553). https://patentable.app/patents/US-8466553","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466553","json":"https://patentable.app/api/llm-context/US-8466553","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:54:13.520Z"}