{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466554","patent":{"patent_number":"US-8466554","title":"Electronic device having interconnections, openings, and pads having greater width than the openings","assignee":null,"inventors":[],"filing_date":"2011-02-16T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic device having interconnections, openings, and pads having greater width than the openings","description":"An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material la","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466554","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466554","citation_suggestion":"Patentable. \"Electronic device having interconnections, openings, and pads having greater width than the openings\" (US-8466554). https://patentable.app/patents/US-8466554","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466554","json":"https://patentable.app/api/llm-context/US-8466554","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:13:50.197Z"}