{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466557","patent":{"patent_number":"US-8466557","title":"Solder bump confinement system for an integrated circuit package","assignee":null,"inventors":[],"filing_date":"2010-04-07T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A solder bump confinement system is provided includes a substrate; a contact material patterned on the substrate; an inner passivation layer deposited over the contact material and the substrate; an under bump material pad over the contact material; an under bump material defining layer, having a bump opening contained therein, directly on the under bump material pad in which the under bump material defining layer has a thickness in the range of 200 Angstrom to 1500 Angstrom; and a system interconnect formed over the contact material and coupled to the under bump material defining layer and the under bump material pad through the bump opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder bump confinement system for an integrated circuit package","description":"A solder bump confinement system is provided includes a substrate; a contact material patterned on the substrate; an inner passivation layer deposited over the contact material and the substrate; an u","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466557","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466557","citation_suggestion":"Patentable. \"Solder bump confinement system for an integrated circuit package\" (US-8466557). https://patentable.app/patents/US-8466557","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466557","json":"https://patentable.app/api/llm-context/US-8466557","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:51:09.850Z"}