{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8470613","patent":{"patent_number":"US-8470613","title":"Flexible packaging for chip-on-chip and package-on-package technologies","assignee":null,"inventors":[],"filing_date":"2011-12-12T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation), and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other ICs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. A second set of pads may be connected to package pins for package-on-package solutions. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flexible packaging for chip-on-chip and package-on-package technologies","description":"In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the applicat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8470613","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8470613","citation_suggestion":"Patentable. \"Flexible packaging for chip-on-chip and package-on-package technologies\" (US-8470613). https://patentable.app/patents/US-8470613","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8470613","json":"https://patentable.app/api/llm-context/US-8470613","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:11:58.870Z"}