{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8470643","patent":{"patent_number":"US-8470643","title":"Manufacturing method of semiconductor packages","assignee":null,"inventors":[],"filing_date":"2011-06-23T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"Conductive core balls are joined to joint pads formed on an upper substrate. Core balls are joined to joint pads formed on an extending part of an upper-substrate substrate material. The joint pads formed on the extending part of the upper-substrate substrate material are joined to the joint pads formed on an extending part of a lower-substrate substrate material via the core balls. The joint pads formed in an area corresponding to the upper substrate of the upper-substrate substrate material are connected to the joint pads formed in an area corresponding to a lower substrate of the lower-substrate substrate material via the core balls and the conductive core balls. The upper-substrate substrate material is fixed to the lower-substrate substrate material by a mold resin supplied therebetween. The extending parts of the upper-substrate substrate material and the lower-substrate substrate material are removed, and the semiconductor packages are individualized."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of semiconductor packages","description":"Conductive core balls are joined to joint pads formed on an upper substrate. Core balls are joined to joint pads formed on an extending part of an upper-substrate substrate material. The joint pads fo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8470643","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8470643","citation_suggestion":"Patentable. \"Manufacturing method of semiconductor packages\" (US-8470643). https://patentable.app/patents/US-8470643","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8470643","json":"https://patentable.app/api/llm-context/US-8470643","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:09:29.369Z"}