{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8470644","patent":{"patent_number":"US-8470644","title":"Exposed die package for direct surface mounting","assignee":null,"inventors":[],"filing_date":"2012-10-05T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the die. A die pad and leads are encapsulated within the molding material. The leads include an exposed portion that includes a bonding portion. A gap exposes the backside metal layer along a bottom surface of the package. Bond wires couple the pads on the topside of the die to the leads and the bonding portions. Packaged semiconductor device is soldered to a printed circuit board (PCB). The backside metal layer and the bonding portions of the leads are soldered substrate pads on said PCB."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Exposed die package for direct surface mounting","description":"A method of forming an electronic assembly includes attaching a backside metal layer the bottomside of a semiconductor die. An area of the backside metal layer matches an area of the bottomside of the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8470644","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8470644","citation_suggestion":"Patentable. \"Exposed die package for direct surface mounting\" (US-8470644). https://patentable.app/patents/US-8470644","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8470644","json":"https://patentable.app/api/llm-context/US-8470644","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:55:00.075Z"}