{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8470937","patent":{"patent_number":"US-8470937","title":"Curable composition for semiconductor encapsulation","assignee":null,"inventors":[],"filing_date":"2011-05-26T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":14,"abstract":"Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Curable composition for semiconductor encapsulation","description":"Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibili","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8470937","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8470937","citation_suggestion":"Patentable. \"Curable composition for semiconductor encapsulation\" (US-8470937). https://patentable.app/patents/US-8470937","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8470937","json":"https://patentable.app/api/llm-context/US-8470937","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:45:44.717Z"}