{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8471373","patent":{"patent_number":"US-8471373","title":"Resin-sealed semiconductor device and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2011-06-03T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A resin-sealed semiconductor device includes a power element (1), a control element (4), a first lead frame (3) having a first die pad (3A) which holds the power element (1), a second lead frame (5) having a second die pad (5A) which holds the control element (4), and a housing (6) made of a resin material and sealing the power element, the first die pad, the control element, and the second die pad. A lower surface of the second die pad is higher than an upper surface of the first element, and at least part of the first die pad and at least part of the second die pad overlap each other when viewed from the top. One of the first leads and one of the second leads are directly joined together by a joint portion (23) and electrically coupled together in the housing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin-sealed semiconductor device and method for fabricating the same","description":"A resin-sealed semiconductor device includes a power element (1), a control element (4), a first lead frame (3) having a first die pad (3A) which holds the power element (1), a second lead frame (5) h","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8471373","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8471373","citation_suggestion":"Patentable. \"Resin-sealed semiconductor device and method for fabricating the same\" (US-8471373). https://patentable.app/patents/US-8471373","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8471373","json":"https://patentable.app/api/llm-context/US-8471373","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:35:18.719Z"}