{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8471376","patent":{"patent_number":"US-8471376","title":"Integrated circuit packaging configurations","assignee":null,"inventors":[],"filing_date":"2010-05-06T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Embodiments of the present disclosure provide a substrate, one of either a semiconductor die or an interposer disposed on the substrate, the semiconductor die or the interposer having a first surface attached to the substrate and a second surface that is opposite to the first surface, one or more interconnect structures formed on the second surface of the semiconductor die or the interposer, a mold compound formed to substantially encapsulate the semiconductor die or the interposer, and one or more vias formed in the mold compound to facilitate coupling the one or more interconnect structures with another component. Other embodiments may be described and/or claimed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging configurations","description":"Embodiments of the present disclosure provide a substrate, one of either a semiconductor die or an interposer disposed on the substrate, the semiconductor die or the interposer having a first surface ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8471376","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8471376","citation_suggestion":"Patentable. \"Integrated circuit packaging configurations\" (US-8471376). https://patentable.app/patents/US-8471376","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8471376","json":"https://patentable.app/api/llm-context/US-8471376","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:36:35.319Z"}