{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8472197","patent":{"patent_number":"US-8472197","title":"Resin-sealed electronic control device and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2010-08-11T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (30A) and a second electronic board (40A) respectively bonded onto an upper surface and a lower surface of a support plate (20A) include outer circuit components (31, 41) and inner circuit components (33, 43) respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components (33, 43) are fitted into a window hole portion (21) of the support plate (20A) and are sealed with a filler (25)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Resin-sealed electronic control device and method of fabricating the same","description":"Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8472197","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8472197","citation_suggestion":"Patentable. \"Resin-sealed electronic control device and method of fabricating the same\" (US-8472197). https://patentable.app/patents/US-8472197","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8472197","json":"https://patentable.app/api/llm-context/US-8472197","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:16:12.418Z"}