{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8472949","patent":{"patent_number":"US-8472949","title":"Semiconductor assembly","assignee":null,"inventors":[],"filing_date":"2006-01-19T00:00:00.000Z","publication_date":"2013-06-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":31,"abstract":"A semiconductor assembly is disclosed. One embodiment provides a first semiconductor and a second semiconductor, each having a first main connection and a second main connection arranged on opposite sides, and a carrier having a patterned metallization with a first section spaced apart from a second section. The first semiconductor is electrically connected to the first section by its second main connection, and the second semiconductor electrically connected to the second section by its second main connection. The first semiconductor chip first main connection and the second semiconductor chip first main connection are electrically connected to one another and for the connection of an external load or of an external supply voltage."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor assembly","description":"A semiconductor assembly is disclosed. One embodiment provides a first semiconductor and a second semiconductor, each having a first main connection and a second main connection arranged on opposite s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8472949","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8472949","citation_suggestion":"Patentable. \"Semiconductor assembly\" (US-8472949). https://patentable.app/patents/US-8472949","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8472949","json":"https://patentable.app/api/llm-context/US-8472949","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:28:10.814Z"}