{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476163","patent":{"patent_number":"US-8476163","title":"Semiconductor device and manufacturing method therefor","assignee":null,"inventors":[],"filing_date":"2011-11-08T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":15,"abstract":"A method for manufacturing a semiconductor device includes providing a substrate having a first surface and a second surface, the second surface is on the opposite side of the substrate facing away from the first surface. The method further includes forming a first portion of an opening by etching a portion of the substrate from the first surface, forming a buffer layer on an inner surface of the first portion, etching a bottom of the buffer layer to expose an area of the underlying substrate, and etching the exposed area of the substrate to form a second portion of the opening. The method also includes performing an isotropic etching on the second portion of the opening to obtain a flask-shaped opening and filling the opening with a filling material. The method also includes partially removing a portion of the second surface and the filling material from the second portion of the opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and manufacturing method therefor","description":"A method for manufacturing a semiconductor device includes providing a substrate having a first surface and a second surface, the second surface is on the opposite side of the substrate facing away fr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476163","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476163","citation_suggestion":"Patentable. \"Semiconductor device and manufacturing method therefor\" (US-8476163). https://patentable.app/patents/US-8476163","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476163","json":"https://patentable.app/api/llm-context/US-8476163","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:15:55.647Z"}