{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476720","patent":{"patent_number":"US-8476720","title":"Systems and methods for vertically stacking a sensor on an integrated circuit chip","assignee":null,"inventors":[],"filing_date":"2011-06-29T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems and methods for vertically stacking a sensor on an integrated circuit chip","description":"A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476720","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476720","citation_suggestion":"Patentable. \"Systems and methods for vertically stacking a sensor on an integrated circuit chip\" (US-8476720). https://patentable.app/patents/US-8476720","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476720","json":"https://patentable.app/api/llm-context/US-8476720","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:22:45.913Z"}