{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476738","patent":{"patent_number":"US-8476738","title":"Electronic package with stacked semiconductor chips","assignee":null,"inventors":[],"filing_date":"2010-06-29T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging layer. The first and second electronic component package modules respectively include at least two semiconductor chips laminated. A first redistribution layer is between the first and the second electronic component package modules, electrically connected to the first and the second electronic component package modules. A conductive bump is mounted on a bottom of the second electronic component package module, electrically connected to the second electronic component package module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package with stacked semiconductor chips","description":"An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic compo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476738","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476738","citation_suggestion":"Patentable. \"Electronic package with stacked semiconductor chips\" (US-8476738). https://patentable.app/patents/US-8476738","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476738","json":"https://patentable.app/api/llm-context/US-8476738","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:22:31.898Z"}