{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476746","patent":{"patent_number":"US-8476746","title":"Package structure enhancing molding compound bondability","assignee":null,"inventors":[],"filing_date":"2010-08-17T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A leadframe enhancing molding compound bondability includes a chip base and a pin holder. The chip bases includes a chip pad and a support, wherein the chip pad includes a side protrusion extending out of the support, and the side protrusion has a lower surface, and the support has a sidewall, and wherein the lower surface and the sidewall interconnect at an intersection line, and the lower surface is formed upwardly with a recess. Further, a pin holder includes a pin stand and a seat, wherein the pin stand has an edge portion extending out of the seat, the edge portion has a lower surface, the seat has a sidewall, and the lower surface and the sidewall interconnect at a crossing line. The lower surface of the pin stand is formed upward with a recess. As such, the bondability between the leadframe and the molding compound can be greatly enhanced."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure enhancing molding compound bondability","description":"A leadframe enhancing molding compound bondability includes a chip base and a pin holder. The chip bases includes a chip pad and a support, wherein the chip pad includes a side protrusion extending ou","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476746","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476746","citation_suggestion":"Patentable. \"Package structure enhancing molding compound bondability\" (US-8476746). https://patentable.app/patents/US-8476746","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476746","json":"https://patentable.app/api/llm-context/US-8476746","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:35:25.788Z"}