{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476756","patent":{"patent_number":"US-8476756","title":"Semiconductor device and heat sink with 3-dimensional thermal conductivity","assignee":null,"inventors":[],"filing_date":"2011-09-21T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A semiconductor device includes a semiconductor element having a rectangular two-dimensional geometry and serving as a heat source, a first heat sink section including the semiconductor element mounted thereon, and a second heat sink section joined to an opposite side of the first heat sink section that includes the semiconductor element. A relation among directional components of thermal conductivity is K1yy≧K1xx>K1zz, where directional components of a three-dimensional thermal conductivity of the heat sink section in X, Y, and Z directions are determined as Kxx, Kyy, and Kzz. A relation among directional components of a thermal conductivity of the second heat sink section is K2zz≧K2yy>K2xx or K2yy≧K2zz>K2xx, where the directional components of the thermal conductivity of the second heat sink section in X, Y, and X directions are determined as K2xx, K2yy, and K2zz. "},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and heat sink with 3-dimensional thermal conductivity","description":"A semiconductor device includes a semiconductor element having a rectangular two-dimensional geometry and serving as a heat source, a first heat sink section including the semiconductor element mounte","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476756","citation_suggestion":"Patentable. \"Semiconductor device and heat sink with 3-dimensional thermal conductivity\" (US-8476756). https://patentable.app/patents/US-8476756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476756","json":"https://patentable.app/api/llm-context/US-8476756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:14:56.128Z"}