{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8476760","patent":{"patent_number":"US-8476760","title":"Electroplated posts with reduced topography and stress","assignee":null,"inventors":[],"filing_date":"2011-11-03T00:00:00.000Z","publication_date":"2013-07-02T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electroplated posts with reduced topography and stress","description":"Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three si","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8476760","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8476760","citation_suggestion":"Patentable. \"Electroplated posts with reduced topography and stress\" (US-8476760). https://patentable.app/patents/US-8476760","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8476760","json":"https://patentable.app/api/llm-context/US-8476760","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:29:19.396Z"}