{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482002","patent":{"patent_number":"US-8482002","title":"Semiconductor device including bonding pads and semiconductor package including the semiconductor device","assignee":null,"inventors":[],"filing_date":"2009-11-12T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Provided is a semiconductor device that may prevent a test pad planned not to be wire bonded from being wire bonded. The semiconductor device may include a bonding pad planned to be wire bonded and a test pad planned not to be wire bonded, and a passivation layer including a first opening portion exposing part of the bonding pad and a second opening portion exposing part of the test pad, wherein the diameter of the first opening portion is greater than the diameter of a tip of a bonding wire, and the diameter of the second opening portion is less than the diameter of the tip of the bonding wire."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including bonding pads and semiconductor package including the semiconductor device","description":"Provided is a semiconductor device that may prevent a test pad planned not to be wire bonded from being wire bonded. The semiconductor device may include a bonding pad planned to be wire bonded and a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482002","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482002","citation_suggestion":"Patentable. \"Semiconductor device including bonding pads and semiconductor package including the semiconductor device\" (US-8482002). https://patentable.app/patents/US-8482002","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482002","json":"https://patentable.app/api/llm-context/US-8482002","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:55:09.973Z"}