{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482023","patent":{"patent_number":"US-8482023","title":"Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method","assignee":null,"inventors":[],"filing_date":"2007-06-28T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method","description":"Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the lea","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482023","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482023","citation_suggestion":"Patentable. \"Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method\" (US-8482023). https://patentable.app/patents/US-8482023","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482023","json":"https://patentable.app/api/llm-context/US-8482023","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:16:25.059Z"}