{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482112","patent":{"patent_number":"US-8482112","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2011-09-16T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a second die pad; each die pad is supported by one or more supports and isolated from another; at least first and second dice, a first die being disposed on the first die pad and a second die being disposed on the second die pad; wire bonds in communication with the first and second dice; and an encapsulant adapted to encapsulate the die pads, the dice, the lead frame and the wire bonds."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482112","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482112","citation_suggestion":"Patentable. \"Semiconductor package\" (US-8482112). https://patentable.app/patents/US-8482112","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482112","json":"https://patentable.app/api/llm-context/US-8482112","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:52:17.982Z"}