{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482113","patent":{"patent_number":"US-8482113","title":"Semiconductor device","assignee":null,"inventors":[],"filing_date":"2008-04-21T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A package substrate has wires that electrically connect to a semiconductor chip, and surface side terminals that are solid and cylindrical and ends of which are electrically connected to the wires. The semiconductor chip is sealed by a sealing resin layer that is formed by molding a sealing resin so as to cover the semiconductor chip. A surface of the sealing resin layer is made to have a height that is the same as that of end surfaces of other ends of the surface side terminals by grinding. Thus, the surface of the sealing resin layer is a ground surface that is a rough surface and is formed by grinding. The end surfaces of the surface side terminals are exposed at the ground surface of the sealing resin layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device","description":"A package substrate has wires that electrically connect to a semiconductor chip, and surface side terminals that are solid and cylindrical and ends of which are electrically connected to the wires. Th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482113","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482113","citation_suggestion":"Patentable. \"Semiconductor device\" (US-8482113). https://patentable.app/patents/US-8482113","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482113","json":"https://patentable.app/api/llm-context/US-8482113","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:11:51.470Z"}