{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482115","patent":{"patent_number":"US-8482115","title":"Integrated circuit packaging system with dual side connection and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-05-27T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; pressing an encapsulation onto the package carrier and with the integrated circuit therein; mounting a conductive frame, having a vertical pillar integral with a horizontal cover, through the encapsulation, over the integrated circuit, and the vertical pillar on the package carrier and the horizontal cover on the encapsulation; and forming a contact from the horizontal cover."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with dual side connection and method of manufacture thereof","description":"A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; pressing an encapsulation onto the package carrier and with the integ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482115","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482115","citation_suggestion":"Patentable. \"Integrated circuit packaging system with dual side connection and method of manufacture thereof\" (US-8482115). https://patentable.app/patents/US-8482115","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482115","json":"https://patentable.app/api/llm-context/US-8482115","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:13:57.588Z"}