{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482120","patent":{"patent_number":"US-8482120","title":"Combined heat sink multi-configuration processor memory substrate device","assignee":null,"inventors":[],"filing_date":"2007-12-28T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Combined heat sink multi-configuration processor memory substrate device","description":"A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482120","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482120","citation_suggestion":"Patentable. \"Combined heat sink multi-configuration processor memory substrate device\" (US-8482120). https://patentable.app/patents/US-8482120","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482120","json":"https://patentable.app/api/llm-context/US-8482120","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:04:05.018Z"}