{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482133","patent":{"patent_number":"US-8482133","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2011-07-22T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes a center portion, which has a first recess with a portion of a top of the package substrate removed, and an edge portion that has a plurality of second recesses. Each second recess has a portion of a bottom of the package substrate removed. The plurality of semiconductor chips are mounted in the first recess, and the plurality of connection terminals are respectively disposed in the second recesses."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482133","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482133","citation_suggestion":"Patentable. \"Semiconductor package\" (US-8482133). https://patentable.app/patents/US-8482133","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482133","json":"https://patentable.app/api/llm-context/US-8482133","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:37:44.313Z"}