{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482139","patent":{"patent_number":"US-8482139","title":"Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards","assignee":null,"inventors":[],"filing_date":"2009-11-09T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["G06K","G06K","G06K","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards","description":"A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482139","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482139","citation_suggestion":"Patentable. \"Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards\" (US-8482139). https://patentable.app/patents/US-8482139","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482139","json":"https://patentable.app/api/llm-context/US-8482139","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:15:15.244Z"}