{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8482929","patent":{"patent_number":"US-8482929","title":"Systems for circuit board heat transfer and method of assembling same","assignee":null,"inventors":[],"filing_date":"2011-05-17T00:00:00.000Z","publication_date":"2013-07-09T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":10,"abstract":"A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Systems for circuit board heat transfer and method of assembling same","description":"A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8482929","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8482929","citation_suggestion":"Patentable. \"Systems for circuit board heat transfer and method of assembling same\" (US-8482929). https://patentable.app/patents/US-8482929","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8482929","json":"https://patentable.app/api/llm-context/US-8482929","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:24.583Z"}