{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8484837","patent":{"patent_number":"US-8484837","title":"Method for conductively connecting a component on a transparent substrate","assignee":null,"inventors":[],"filing_date":"2011-10-13T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":33,"abstract":"The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for conductively connecting a component on a transparent substrate","description":"The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8484837","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8484837","citation_suggestion":"Patentable. \"Method for conductively connecting a component on a transparent substrate\" (US-8484837). https://patentable.app/patents/US-8484837","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8484837","json":"https://patentable.app/api/llm-context/US-8484837","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:12:22.400Z"}