{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8486756","patent":{"patent_number":"US-8486756","title":"Flip chip bonded semiconductor device with shelf and method of manufacturing thereof","assignee":null,"inventors":[],"filing_date":"2008-12-23T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flip chip bonded semiconductor device with shelf and method of manufacturing thereof","description":"The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripher","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8486756","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8486756","citation_suggestion":"Patentable. \"Flip chip bonded semiconductor device with shelf and method of manufacturing thereof\" (US-8486756). https://patentable.app/patents/US-8486756","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8486756","json":"https://patentable.app/api/llm-context/US-8486756","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T22:29:43.226Z"}