{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8486829","patent":{"patent_number":"US-8486829","title":"Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via","assignee":null,"inventors":[],"filing_date":"2012-12-19T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"The present invention relates to a semiconductor element having a conductive via and a method for making the same and a package having a semiconductor element with a conductive via. The semiconductor element includes a silicon chip and at least one conductive via. The silicon chip includes a silicon substrate and an active circuit layer. The active circuit layer is disposed on a second surface of the silicon substrate, and has at least one metal layer. The conductive via penetrates the silicon substrate, and includes a conductive metal, The conductive metal electrically connects to the metal layer of the active circuit layer, and a surface of the conductive metal is exposed to the outside of a first surface of the silicon substrate. Therefore, a chip is able to be directly stacked on the semiconductor element without forming a passivation layer and a redistribution layer on the first surface of the silicon substrate, and the process is simplified and the manufacturing cost is decreased."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via","description":"The present invention relates to a semiconductor element having a conductive via and a method for making the same and a package having a semiconductor element with a conductive via. The semiconductor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8486829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8486829","citation_suggestion":"Patentable. \"Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via\" (US-8486829). https://patentable.app/patents/US-8486829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8486829","json":"https://patentable.app/api/llm-context/US-8486829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:39:16.263Z"}