{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487419","patent":{"patent_number":"US-8487419","title":"Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus","assignee":null,"inventors":[],"filing_date":"2012-01-11T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus","description":"A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mountin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487419","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487419","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus\" (US-8487419). https://patentable.app/patents/US-8487419","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487419","json":"https://patentable.app/api/llm-context/US-8487419","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:21:09.053Z"}