{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487426","patent":{"patent_number":"US-8487426","title":"Semiconductor package with embedded die and manufacturing methods thereof","assignee":null,"inventors":[],"filing_date":"2011-03-15T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a conductive base, a die disposed adjacent to an upper surface of the conductive base, a patterned conductive layer, and a dielectric layer encapsulating the die. The dielectric layer defines an opening through which the patterned conductive layer is electrically connected to the upper surface of the conductive base. The conductive base has a lateral surface including a first portion adjacent to the upper surface of the conductive base and a second portion adjacent to a lower surface of the conductive base, where the second portion is sloped inwardly with respect to the lower surface of the conductive base."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with embedded die and manufacturing methods thereof","description":"A semiconductor package includes a conductive base, a die disposed adjacent to an upper surface of the conductive base, a patterned conductive layer, and a dielectric layer encapsulating the die. The ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487426","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487426","citation_suggestion":"Patentable. \"Semiconductor package with embedded die and manufacturing methods thereof\" (US-8487426). https://patentable.app/patents/US-8487426","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487426","json":"https://patentable.app/api/llm-context/US-8487426","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:30:24.831Z"}