{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487429","patent":{"patent_number":"US-8487429","title":"Assembly of multi-chip modules using sacrificial features","assignee":null,"inventors":[],"filing_date":"2009-09-22T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Assembly of multi-chip modules using sacrificial features","description":"A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487429","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487429","citation_suggestion":"Patentable. \"Assembly of multi-chip modules using sacrificial features\" (US-8487429). https://patentable.app/patents/US-8487429","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487429","json":"https://patentable.app/api/llm-context/US-8487429","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:13:36.401Z"}