{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487430","patent":{"patent_number":"US-8487430","title":"Multi-layer high-speed integrated circuit ball grid array package and process","assignee":null,"inventors":[],"filing_date":"2010-01-21T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Examples of high-speed ball grid array packages and a process of forming a package are provided. A package may include contact pads disposed on a bottom surface, conductive balls, and a signal via structure. The package may also include a first ground via structure arranged along one or more first semi-circular contours around the signal via structure and extending vertically and a second ground via structure arranged along one or more second semi-circular contours around the signal via structure and extending vertically. The package may include a ground interface plane disposed in separation from the signal contact pad by a distance. The distance may be determined based on at least a size of the signal contact pad, a dielectric constant of a transition layer between the ground interface plane and the signal contact pad, and a distance between the signal via structure and the second ground via structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-layer high-speed integrated circuit ball grid array package and process","description":"Examples of high-speed ball grid array packages and a process of forming a package are provided. A package may include contact pads disposed on a bottom surface, conductive balls, and a signal via str","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487430","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487430","citation_suggestion":"Patentable. \"Multi-layer high-speed integrated circuit ball grid array package and process\" (US-8487430). https://patentable.app/patents/US-8487430","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487430","json":"https://patentable.app/api/llm-context/US-8487430","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:51:24.223Z"}