{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487452","patent":{"patent_number":"US-8487452","title":"Semiconductor package having a stacked structure","assignee":null,"inventors":[],"filing_date":"2011-07-01T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package, the second semiconductor chip is rotated to be stacked on the first semiconductor chip. The semiconductor package is used in an electronic system."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package having a stacked structure","description":"A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487452","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487452","citation_suggestion":"Patentable. \"Semiconductor package having a stacked structure\" (US-8487452). https://patentable.app/patents/US-8487452","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487452","json":"https://patentable.app/api/llm-context/US-8487452","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:15:20.424Z"}