{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8487454","patent":{"patent_number":"US-8487454","title":"Leadframe, semiconductor device, and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2012-03-22T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"A semiconductor device includes a die pad, the die pad including a first surface and a second surface, a first chip arranged on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged on the first surface, a plurality of first recesses formed on the first surface, a plurality of second recesses formed on the first surface, the plurality of second recesses being different from the first plurality of recesses in at least one of size and geometry, a wire, a resin, and a lead, one end of the lead being connected to another end of the wire and a part the lead being encapsulated by the resin. The plurality of first recesses includes a third recess and a fourth recess, and the first chip is arranged in a first area."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Leadframe, semiconductor device, and method of manufacturing the same","description":"A semiconductor device includes a die pad, the die pad including a first surface and a second surface, a first chip arranged on the first surface, the first chip including a first side and a second si","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8487454","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8487454","citation_suggestion":"Patentable. \"Leadframe, semiconductor device, and method of manufacturing the same\" (US-8487454). https://patentable.app/patents/US-8487454","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8487454","json":"https://patentable.app/api/llm-context/US-8487454","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:04:56.653Z"}