{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8488329","patent":{"patent_number":"US-8488329","title":"Power and ground vias for power distribution systems","assignee":null,"inventors":[],"filing_date":"2010-05-10T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":10,"abstract":"A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power and ground vias for power distribution systems","description":"A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more con","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8488329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8488329","citation_suggestion":"Patentable. \"Power and ground vias for power distribution systems\" (US-8488329). https://patentable.app/patents/US-8488329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8488329","json":"https://patentable.app/api/llm-context/US-8488329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:36:53.244Z"}