{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8489217","patent":{"patent_number":"US-8489217","title":"Thermal cycling and gradient management in three-dimensional stacked architectures","assignee":null,"inventors":[],"filing_date":"2011-01-04T00:00:00.000Z","publication_date":"2013-07-16T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":21,"abstract":"A mechanism is provided for minimizing reliability problems in a three-dimensional (3D) integrated circuit. A set of sensors are interrogated for current data. A direction of force and a magnitude of the force are determined based on the current data for each sensor in the set of sensors for each of one or more directions between the sensor and at least one neighboring sensor thereby forming a set of forces. Each of the set of forces is used to identify one or more points of stress that are at or above the predetermined force threshold. Responsive to identifying at least one point of stress that is at or above the predetermined force threshold, one or more temperature actuation actions are initiated in order to reduce at least one point of stress in the region where the at least one point of stress is identified."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal cycling and gradient management in three-dimensional stacked architectures","description":"A mechanism is provided for minimizing reliability problems in a three-dimensional (3D) integrated circuit. A set of sensors are interrogated for current data. A direction of force and a magnitude of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8489217","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8489217","citation_suggestion":"Patentable. \"Thermal cycling and gradient management in three-dimensional stacked architectures\" (US-8489217). https://patentable.app/patents/US-8489217","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8489217","json":"https://patentable.app/api/llm-context/US-8489217","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:38:59.667Z"}