{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8491998","patent":{"patent_number":"US-8491998","title":"Composite nanometal paste of two-metallic-component type, bonding method, and electronic part","assignee":null,"inventors":[],"filing_date":"2009-07-16T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","B82Y","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to conventional lead-rich solders. The composite nanometal paste contains, as metal components, composite metal nanoparticles comprising metal cores with an average particle diameter of d (nm) and an organic coating layer formed around the circumference, and metal filler particles having an average particle diameter of D (nm), and satisfies the first relation d<D and the second relation d<100 (nm). When said organic coating layer volatilizes so that a metal layer is formed by sintering, the size relation between said average particle diameters d, D is designed so that said composite metal nanoparticle can be embedded in a hollow four pocket formed when it is assumed that four said metal filler particles are placed so that they come in contact with a tetrahedron, and it has a property in which said composite metal nanoparticles and said metal filler particles sinter compactly."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Composite nanometal paste of two-metallic-component type, bonding method, and electronic part","description":"Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8491998","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8491998","citation_suggestion":"Patentable. \"Composite nanometal paste of two-metallic-component type, bonding method, and electronic part\" (US-8491998). https://patentable.app/patents/US-8491998","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8491998","json":"https://patentable.app/api/llm-context/US-8491998","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:33:39.314Z"}