{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492178","patent":{"patent_number":"US-8492178","title":"Method of monitoring fabrication processing including edge bead removal processing","assignee":null,"inventors":[],"filing_date":"2008-02-25T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["G06T","G01N","G01N","H01L","G01N","G06T"],"num_claims":17,"abstract":"Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of monitoring fabrication processing including edge bead removal processing","description":"Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492178","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492178","citation_suggestion":"Patentable. \"Method of monitoring fabrication processing including edge bead removal processing\" (US-8492178). https://patentable.app/patents/US-8492178","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492178","json":"https://patentable.app/api/llm-context/US-8492178","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:44:42.006Z"}