{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492241","patent":{"patent_number":"US-8492241","title":"Method for simultaneously forming a through silicon via and a deep trench structure","assignee":null,"inventors":[],"filing_date":"2010-10-14T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L","H01L"],"num_claims":20,"abstract":"A through silicon via (TSV) and a deep trench capacitor (DTCap) or a deep trench isolation (DTI) are simultaneously formed on the same substrate by a single mask and a single reactive ion etching (RIE). The TSV trench is wider and deeper that the DTCap or DTI trench. The TSV and DTCap or DTI are formed with different dielectric materials on the trench sidewalls. The TSV and DTCap or DTI are perfectly aligned."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for simultaneously forming a through silicon via and a deep trench structure","description":"A through silicon via (TSV) and a deep trench capacitor (DTCap) or a deep trench isolation (DTI) are simultaneously formed on the same substrate by a single mask and a single reactive ion etching (RIE","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492241","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492241","citation_suggestion":"Patentable. \"Method for simultaneously forming a through silicon via and a deep trench structure\" (US-8492241). https://patentable.app/patents/US-8492241","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492241","json":"https://patentable.app/api/llm-context/US-8492241","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:17:33.003Z"}