{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492256","patent":{"patent_number":"US-8492256","title":"Method of manufacturing semiconductor apparatus","assignee":null,"inventors":[],"filing_date":"2011-04-12T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":36,"abstract":"A method of manufacturing a semiconductor apparatus includes forming back surface electrode 4 on back surface of semiconductor wafer 20, that bends convexly toward the front surface side due to back surface electrode 4 being formed; treating the back surface with a plasma for removing the deposits on the back surface; sticking removable adhesive tape 23 to the back surface along the warp thereof for maintaining the bending state of semiconductor wafer 20 after the step of sticking; electrolessly plating to form film 26 on the front surface of semiconductor wafer 20; peeling off removable adhesive tape 23; cutting out semiconductor chips; and mounting the semiconductor chip by bonding with a solder for manufacturing a semiconductor apparatus. The manufacturing method prevents external appearance anomalies from occurring on the back surface electrode, improves the reliability, and allows manufacture of the semiconductor apparatuses with a high throughput of non-defective products."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor apparatus","description":"A method of manufacturing a semiconductor apparatus includes forming back surface electrode 4 on back surface of semiconductor wafer 20, that bends convexly toward the front surface side due to back s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492256","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492256","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor apparatus\" (US-8492256). https://patentable.app/patents/US-8492256","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492256","json":"https://patentable.app/api/llm-context/US-8492256","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:51:22.238Z"}