{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492295","patent":{"patent_number":"US-8492295","title":"On-chip cooling for integrated circuits","assignee":null,"inventors":[],"filing_date":"2012-09-13T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":10,"abstract":"A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region is heated at a high temperature sufficiently high to result in the temporary filling material being replaced by a cooling pipes system that does not include any solid or liquid material. A first portion and a second portion of the cooling pipes system are each in direct physical contact with a surrounding ambient at a first interface and a second interface respectively such that a first direction perpendicular to the first interface is perpendicular to a second direction perpendicular to the second interface. A totality of interfaces between the cooling pipes system and the ambient consists of the first interface and the second interface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"On-chip cooling for integrated circuits","description":"A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492295","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492295","citation_suggestion":"Patentable. \"On-chip cooling for integrated circuits\" (US-8492295). https://patentable.app/patents/US-8492295","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492295","json":"https://patentable.app/api/llm-context/US-8492295","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:22:16.145Z"}