{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492869","patent":{"patent_number":"US-8492869","title":"3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer","assignee":null,"inventors":[],"filing_date":"2012-08-10T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A 3D integrated circuit structure is provided. The 3D integrated circuit structure includes an interface wafer including a first wiring layer, a first active circuitry layer including active circuitry, and a wafer including active circuitry. The first active circuitry layer is bonded face down to the interface wafer, and the wafer is bonded face down to the first active circuitry layer. The first active circuitry layer is lower-cost than the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer","description":"A 3D integrated circuit structure is provided. The 3D integrated circuit structure includes an interface wafer including a first wiring layer, a first active circuitry layer including active circuitry","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492869","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492869","citation_suggestion":"Patentable. \"3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer\" (US-8492869). https://patentable.app/patents/US-8492869","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492869","json":"https://patentable.app/api/llm-context/US-8492869","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:17:06.829Z"}