{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492870","patent":{"patent_number":"US-8492870","title":"Semiconductor package with interconnect layers","assignee":null,"inventors":[],"filing_date":"2011-06-13T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A chip package comprising a glass substrate, wherein a first opening in the glass substrate passes vertically through the glass substrate, a semiconductor chip, a wiring structure comprising a first portion in the first opening and a second portion over the glass substrate, wherein the first portion is connected to the semiconductor chip, wherein the wiring structure comprises a passive device, wherein the wiring structure comprises copper, and a dielectric layer over the glass substrate and on the wiring structure, wherein a second opening in the dielectric layer is over a contact point of the wiring structure, and the contact point is at a bottom of the second opening."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with interconnect layers","description":"A chip package comprising a glass substrate, wherein a first opening in the glass substrate passes vertically through the glass substrate, a semiconductor chip, a wiring structure comprising a first p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492870","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492870","citation_suggestion":"Patentable. \"Semiconductor package with interconnect layers\" (US-8492870). https://patentable.app/patents/US-8492870","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492870","json":"https://patentable.app/api/llm-context/US-8492870","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:56:30.513Z"}