{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8492895","patent":{"patent_number":"US-8492895","title":"Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit","assignee":null,"inventors":[],"filing_date":"2011-08-10T00:00:00.000Z","publication_date":"2013-07-23T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor chip such as an MMIC is provided. The semiconductor chip has: a Si semiconductor as a substrate; and a low-loss transmission line, and can be easily connected to a circuit board on which the semiconductor chip is to be mounted and can ensure a stable GND potential. The semiconductor chip is a flip-chip semiconductor chip, and includes: a Si substrate; an integrated circuit manufactured on a main surface of the substrate; a dielectric film formed above the integrated circuit; and a conductor film for grounding formed on an upper surface of the dielectric film. The integrated circuit includes a wiring layer including a signal line which transmits signals for the integrated circuit. The signal line, the dielectric film, and the conductor film constitute a microstrip line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit","description":"A semiconductor chip such as an MMIC is provided. The semiconductor chip has: a Si semiconductor as a substrate; and a low-loss transmission line, and can be easily connected to a circuit board on whi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8492895","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8492895","citation_suggestion":"Patentable. \"Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit\" (US-8492895). https://patentable.app/patents/US-8492895","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8492895","json":"https://patentable.app/api/llm-context/US-8492895","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:56.276Z"}