{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8497157","patent":{"patent_number":"US-8497157","title":"Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2012-04-30T00:00:00.000Z","publication_date":"2013-07-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"In a method of manufacturing a semiconductor device, a front end of line (FEOL) process may be performed on a semiconductor substrate to form a semiconductor structure. A back end of line (BEOL) process may be performed on the semiconductor substrate to form a wiring structure electrically connected to the semiconductor structure, thereby formed a semiconductor chip. A hole may be formed through a part of the semiconductor chip. A preliminary plug may have a dimple in the hole. The preliminary plug may be expanded into the dimple by a thermal treatment process to form a plug. Thus, the plug may not have a protrusion protruding from the upper surface of the semiconductor chip, so that the plug may be formed by the single CMP process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same","description":"In a method of manufacturing a semiconductor device, a front end of line (FEOL) process may be performed on a semiconductor substrate to form a semiconductor structure. A back end of line (BEOL) proce","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8497157","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8497157","citation_suggestion":"Patentable. \"Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same\" (US-8497157). https://patentable.app/patents/US-8497157","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8497157","json":"https://patentable.app/api/llm-context/US-8497157","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T15:48:17.706Z"}