{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8497166","patent":{"patent_number":"US-8497166","title":"Electronic device and method of manufacturing electronic device","assignee":null,"inventors":[],"filing_date":"2010-08-24T00:00:00.000Z","publication_date":"2013-07-30T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is bonded is covered with a synthetic resin (130) is manufactured by injecting an amount of synthetic resin (130) into the case (110) such that at least a portion of the metal wire (119) is exposed from a top surface of the synthetic resin (130); and leaving the case (110) to which the synthetic resin (130) is injected under reduced pressure so as to raise a liquid surface of the synthetic resin (130) due to the reduced pressure, and covering the metal wire (119) exposed from the top surface of the synthetic resin (130) with the synthetic resin (30, 130)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic device and method of manufacturing electronic device","description":"An electronic device in which a metal wire (119) is bonded to an electronic component (111) contained in a case (110) by wire bonding and a bonding surface (121, 122) to which the metal wire (119) is ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8497166","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8497166","citation_suggestion":"Patentable. \"Electronic device and method of manufacturing electronic device\" (US-8497166). https://patentable.app/patents/US-8497166","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8497166","json":"https://patentable.app/api/llm-context/US-8497166","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:31:45.969Z"}